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PR33MF51NSZF Series
■ Manufacturing Guidelines
● Soldering Method
Re ? ow Soldering :
Re ? ow soldering should follow the temperature pro ? le shown below.
Soldering should not exceed the curve of temperature pro ? le and time.
Please don't solder more than twice.
( ? C)
300
Terminal : 260 ? C peak
(package surface : 250 ? C peak)
200
Reflow
220 ? C or more, 60s or less
100
Preheat
150 to 180 ? C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering (No Solder bathing)
Flow soldering should be completed below 270 ? C and within 10s.
Preheating is within the bounds of 100 to 150 ? C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400 ? C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works ? ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A03901EN
10
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